Plane array package interconnect bump drop-on-demand printing platform control system

Abstract:

A micro-droplet printing deposition 3-axis motion platform was established to achieve efficient plane array package interconnect solder bumps jet printing. The platform and the multi-axis motion control system were developed based on LabVIEW, with the structure of “PC+ motion control card”. According to the coordinate data of the solder bumps, the jet printing movement path optimization was realized with ant colony algorithm, and the efficiency of movement was also improved effectively. A laser interferometer was used to measure the repeatability and positioning accuracy of the motion platform, and the results showed that the motion platform could meet the accuracy requirement of the BGA packaging technology.