| Author Name | Affiliation | Postcode | | Chunju Wang* | School of Mechanical and Electrical Engineering,Robotics and Microsystems Center,Soochow University,Suzhou 215131,China | 215131 | | Xueyi Chen | School of Mechanical and Electrical Engineering,Robotics and Microsystems Center,Soochow University,Suzhou 215131,China | 215131 | | Da Qian | School of Mechanical and Electrical Engineering,Robotics and Microsystems Center,Soochow University,Suzhou 215131,China | 215131 | | Jinhui Xie | School of Mechanical and Electrical Engineering,Robotics and Microsystems Center,Soochow University,Suzhou 215131,China | 215131 | | Haidong He | School of Mechanical and Electrical Engineering,Robotics and Microsystems Center,Soochow University,Suzhou 215131,China | 215131 | | Lining Sun | School of Mechanical and Electrical Engineering,Robotics and Microsystems Center,Soochow University,Suzhou 215131,China | 215131 | | Yangjun Wang | School of Mechanical and Electrical Engineering,Robotics and Microsystems Center,Soochow University,Suzhou 215131,China | 215131 |
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| Abstract: |
| Metal-based Micro-Electro-Mechanical Systems (MEMS) thin film sensors can achieve accurate in-situ measurement and withstand harsh working conditions, large ranges, etc., with broad application prospects. However, there are significant differences in performance such as thermal matching between metallic substrates and functional films, which can easily lead to defects such as sensitive film detachment. For this reason, this paper carried out a study on the preparation process of Ti, Cr, and Ni transition layer films on stainless-steel substrates, and analyzed the influence of process parameters on the surface roughness and deposition rate of the films. Then, the influence of hybrid transition layers was studied from the viewpoint of the bonding force between the substrate and the insulation layer using the scratch tests. The results showed that transition layer could significantly increase the bonding force between the SiO2 insulation layer and the stainless-steel substrate, from 15N to 45N, indicating improved interfacial adhesion, which is beneficial for the reliability of metal-based MEMS sensors under harsh working conditions. |
| Key words: Metal-based MEMS sensor Multilayer films Surface roughness and deposition rate Bonding force Material performance matching |
| DOI：10.11916/j.issn.1005-9113.25058 |
| Clc Number:TB31 |
| Fund: |
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| Descriptions in Chinese: |
| 金属基微电机械系统（MEMS）薄膜传感器可以实现精确的原位测量，可承受恶劣的工作条件，具有大量程，拥有广泛的应用前景。然而，薄膜与基底在性能上存在显著差异，例如之间的热匹配问题很容易导致敏感膜脱落等缺陷。因此，本文研究了在不锈钢基底上制备Ti、Cr和Ni过渡层，并分析了工艺参数对薄膜表面粗糙度和沉积速率的影响。然后，从基底与绝缘层之间的角度研究了复合过渡层对结合力的影响，使用划痕测试进行了分析。结果表明，过渡层可以显著提高SiO2绝缘层与不锈钢基底之间的结合力，从15N增加到45N。这意味着通过复合过渡层可以解决热膨胀系数不匹配的问题，可以满足基于金属的MEMS传感器对于恶劣工作条件的要求。 |
